Its role among notable custom packaging developers recognizes the company’s dedication to striving for excellence in custom ...

Rode's second video-focused Rodecaster offers comprehensive production tools that almost rival the older, more expensive ...

Stacking dies introduces layers of complexity driven by multi-physics interactions, which must be addressed at the start of ...

Abstract: SoC floorplanning is crucial as it bridges the system design and the physical design of the chip. In this paper, we present a new floorplanning solution based on a novel floorplan model that ...

Abstract: A Ku-K dual-band antenna array is proposed for antenna-in-package beamforming applications, comprising eight subarrays integrated on an interposer board using ball-grid-array (BGA) packaging ...